- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
Patent holdings for IPC class H01R 12/75
Total number of patents in this class: 460
10-year publication summary
37
|
23
|
47
|
38
|
34
|
53
|
68
|
46
|
43
|
17
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Molex, LLC | 1792 |
28 |
TE Connectivity Solutions GmbH | 2580 |
22 |
Japan Aviation Electronics Industry, Limited | 1585 |
17 |
Foxconn Interconnect Technology Limited | 1034 |
16 |
Phoenix Contact GmbH & Co. KG | 2202 |
12 |
Samtec, Inc. | 455 |
11 |
Sumitomo Wiring Systems, Ltd. | 9367 |
9 |
Dongguan Luxshare Technologies Co., Ltd. | 191 |
9 |
Intel Corporation | 45621 |
8 |
AutoNetworks Technologies, Ltd. | 5809 |
8 |
Dai-Ichi Seiko Co., Ltd. | 289 |
8 |
Sumitomo Electric Industries, Ltd. | 14131 |
7 |
Huawei Technologies Co., Ltd. | 100781 |
7 |
Hirose Electric Co., Ltd. | 325 |
7 |
Raytheon Company | 8535 |
6 |
Tyco Electronics (shanghai) Co. Ltd. | 759 |
6 |
Foxconn (Kunshan) Computer Connector Co., Ltd. | 286 |
6 |
Samsung Electronics Co., Ltd. | 131630 |
5 |
Amphenol Corporation | 748 |
5 |
3m Innovative Properties Company | 18406 |
4 |
Other owners | 259 |